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MOTOROLA
Semiconductor Products Sector Engineering Bulletin
Order No.: EB360/D
Rev. 0, 6/2000
Mechanical Differences Between the
196-pin MAP-BGA and 196-pin PBGA
Packages
This document describes the differences between the 196-pin
Mold Array Process-Ball Grid Array (MAP-BGA) and the
196-pin Plastic Ball Grid Array (PBGA) packages. The MAP -
BGA is an identical pinout and drops into a board laid out for
PBGA. Many members of the DSP56300 family of Digital Signal
Processors will be available in MAP-BGA in 2001. This
document provides the information required to simplify the
transition to the 196-pin MAP-BGA package.
Contents
Summary of Differences ................... 2
Pinout and Electrical Performance .... 2
Dimensions ........................................ 2
Die Changes ...................................... 7
© Motorola, Inc. 2000
196-pin MAP-BGA and PBGA Package
Differences
Summary of Differences
1
Summary of Differences
The 196-pin MAP-BGA will be Motorola’s production ball grid array (BGA) package and will eventually
replace the 196-pin plastic ball grid array (PBGA) on selected member of the DSP56300 family.
Table 1
summarizes the differences between these two packages.
Table 1.
Differences Between 196-Pin MAP-BGA and PBGA
196-pin MAP-BGA
196-pin PBGA
15x 15 mm
1.0mm
N/A
N/A
N/A
N/A
1.60 mm max
50 (no airflow)
MSL3 capable
0.10 mm
Transfer Molding
175 deg. C
Saw cutting
VO
VF
1.75mm max
50 (no airflow)
MSL3 capable
0.15 mm
Liquid dispensing
159 deg C
Punch shear
HB
GC
MAP-BGA has lower maximum profile
N/A
N/A
MAP-BGA has a tighter spec.
Different
Map-BGA superior
Different process but no mechanical differences
MAP-BGA is superior
Different
N/A
N/A
Difference
X-Y Dimensions
Ball Pitch
Pinout
Electrical Perfor-
mance
Package Height
0
JA
Moisture Sensitivity
Coplanarity
Specification
Encapsulent Method
Tg
Singulation
Flammability Rating
Package Identifier
Packing Trays/ Tape
and Reel
Solder Balls
15 x 15 mm
1.0 mm
2
3
Pinout and Electrical Performance
Pinout and electrical performance is identical for a given device on both MAP-BGA and PBGA packages.
For details on pinout and electrical performance, refer to the data sheet of the particular device.
Dimensions
Mechanical drawings of each package are shown in
Figure 1
through
Figure 4.
2
196-pin MAP-BGA and PBGA Package Differences
Dimensions
Figure 1.
PBGA Mechanical Outline 1
196-pin MAP-BGA and PBGA Package Differences
3
Dimensions
Figure 2.
PBGA Mechanical Outline 2
4
196-pin MAP-BGA and PBGA Package Differences
Dimensions
Figure 3.
MAP Mechanical Outline 3
196-pin MAP-BGA and PBGA Package Differences
5

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