Optical Interconnects.pdf

(11659 KB) Pobierz
Optical Interconnects
Copyright © 2007 by Morgan & Claypool
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means—electronic, mechanical, photocopy, recording, or any
other except for brief quotations in printed reviews, without the prior permission of the publisher.
Optical Interconnects
Ray T. Chen and Chulchae Choi
www.morganclaypool.com
ISBN-10: 1598290665
ISBN-13: 9781598290660
ISBN-10: 1598290673
ISBN-13: 9781598290677
paperback
paperback
ebook
ebook
DOI 10.2200/S00029ED1V01Y200605SSM002
A Publication in the Morgan & Claypool Publishers series
SYNTHESIS LECTURES ON SOLID-STATE MATERIAL AND DEVICES #2
Lecture #2
Series Editor: Sanjay Banerjee, University of Texas at Austin
Series ISSN: 1935-1260
Series ISSN: 1935-1724
First Edition
10 9 8 7 6 5 4 3 2 1
print
electronic
Printed in the United States of America
Optical Interconnects
Ray T. Chen
University of Texas at Austin
Chulchae Choi
LG Electronics Institute of Technology
Seoul, Korea
SYNTHESIS LECTURES ON SOLID-STATE MATERIAL AND DEVICES #2
M
&C
Mor gan
&
Cl aypool
Publishers
iv
ABSTRACT
This book describes a fully embedded board level optical interconnects in detail including the
fabrication of the thin-film VCSEL array, its characterization, thermal management, the fab-
rication of optical interconnection layer, and the integration of mentioned devices on a flexible
waveguide film. All the optical components are buried within electrical PCB layers in a fully
embedded board level optical interconnect. Therefore, we can save foot prints on the top real
estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes.
To realize fully embedded board level optical interconnects, many stumbling blocks need to be
addressed such as thin-film transmitter and detector, thermal management, process compati-
bility, reliability, cost effective fabrication process, and easy integration. The material presented
eventually will relieve such concerns and make the integration of optical interconnection highly
feasible. The hybrid integration of the optical interconnection layer and electrical layers is
ongoing.
KEYWORDS
Fully embedded optical interconnection, vertical cavity surface emitting laser – VCSEL, Optical
Interconnection Layer, Printed circuit board (PCB), multichip modules (MCM), very large scale
integrated (VLSI) circuits to ultra large scale integrated (ULSI) circuits
v
Contents
1.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Overview of Optical Interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Fully Embedded Board Level Optical Interconnects . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.4 Chapter Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thinned Vertical Cavity Surface Emitting Laser Fabrication . . . . . . . . . . . . . . . . . . . . . 9
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Design of an Epitaxial Layer Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Fabrication of the Vertical Cavity Surface Emitting Laser . . . . . . . . . . . . . . . . . . . 12
2.3.1 Device Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.2 Selective Wet Oxidation for Current Aperture . . . . . . . . . . . . . . . . . . . . . . 16
2.3.3 Metallization and Thinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
VCSEL Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.1 Electrical and Optical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.2 High-Speed Modulation Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Thermal Management of Embedded VCSEL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.2 Two Dimensional Finite Element Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Optical Interconnection Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.2 Waveguide Micromirror Coupler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.2.1 Coupling Efficiency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.2.2 Fabrication of the 45
◦
Micromirror Coupler . . . . . . . . . . . . . . . . . . . . . . . . 44
5.3 Soft Molding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.3.2 Master and Mold Fabrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.3.3 Deformation Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.
3.
4.
5.

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika:

Zgłoś jeśli naruszono regulamin