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Materials Science and Engineering B 110 (2004) 87–93
Electrical properties of the n-ZnO/c-Si heterojunction
prepared by chemical spray pyrolysis
R. Romero, M.C. López, D. Leinen, F. Mart´n, J.R. Ramos-Barrado
∗
ı
Departamento de F´sica Aplicada y Departamento de Ingenier´a Qu´mica, Laboratorio de Materiales y Superficie (Unidad Asociada al CSIC),
ı
ı
ı
Facultad de Ciencias, Campus de Teatinos, Universidad de Málaga, E29071 Málaga, Spain
Received 20 October 2003; accepted 4 March 2004
Abstract
Electrical, structural and compositional properties of n-ZnO/c-Si heterojunctions prepared by chemical spray pyrolysis on single-crystal
n-type and p-type monocrystalline silicon(1 0 0) substrates are examined with the
C–V
method and admittance spectroscopy at temperature
ranges between 223 and 373 K. The n-ZnO/c-Si heterojunctions show a height barrier consistent with the difference in energy of the work
functions of Si and ZnO; however, the n-ZnO:Al/c-Si heterojunctions present a more complex behavior due to the defects at or near the
n-ZnO:Al/c-Si interface, causing a Fermi energy pinning.
© 2004 Elsevier B.V. All rights reserved.
Keywords:
Spray pyrolysis; n-ZnO/c-Si; Heterojunction; Electrical properties; Admittance spectroscopy;
C–V
method
1. Introduction
Transparent conducting oxides (TCO) are of great inter-
est in electronic and electro-optical applications. They are
used as coatings in a variety of devices as large flat screens
[1],
thin film photovoltaic cells
[2],
antireflective coatings
in conventional silicon solar cells
[3],
light-emitting diodes
(LEDs)
[4],
etc. ZnO is an n-type wide-band gap semicon-
ductor (3.3 eV) with a hexagonal wurtzite structure. Intrinsic
zinc oxide films are highly resistive, but when commonly
doped with Group III elements (Ga, In or Al), they become
conducting. Thin films of Al-doped ZnO (ZnO:Al), AZO,
are emerging as an alternative candidate to Sn-doped In
2
O
3
(ITO), due to features such as non-toxicity, low cost, mate-
rial abundance, and a high level of stability with hydrogen
plasma and heat cycling.
Spray pyrolysis is a useful alternative to the traditional
methods for obtaining thin films of pure and doped ZnO. It
is of particular interest because of its simplicity, low cost
and minimal waste production. The spray pyrolysis process
allows the coating of large surfaces and it is easy to include
in an industrial production line. With spray pyrolysis, the
solution is sprayed directly onto the substrate. A stream of
∗
gas, e.g. compressed air, can be used to help the atomization
of the solution through the nozzle. Sometimes, posterior
thermal treatment is necessary to ensure the elimination of
precursor waste and to allow sintering or crystallographic
phase transformation.
The ITO/Si structure has been extensively studied during
the past two decades, having been obtained by various de-
position technologies for potential application in solar cell
technologies. The conversion efficiencies achieved in so-
lar cells from ITO/c-Si junctions were 10–15% when using
spray pyrolysis
[5–8].
However, little information is avail-
able in the literature on the ZnO/c-Si heterojunction
[9–13]
in spite of the interest in its potential use in solar cells and
other electro-optic devices.
In this paper, we report the electrical, structural and com-
positional properties of the junctions of both pure and Al
(1 at.%) doped thin films of ZnO on p- and n-type silicon,
as obtained by chemical spray pyrolysis.
2. Experimental
Pure and Al doped ZnO thin films were prepared from
4
×
10
−3
M of zinc acetate dihydrate dissolved in ultra pure
water. Compressed air was used to atomize the precursor
solutions. All the films were deposited onto type p polished
Si(1 0 0) n (9
−1
cm) (Topsil, Denmark) and fused silica
Corresponding author. Tel.:
+34-9521-31922;
fax:
+34-9521-32382.
E-mail address:
barrado@uma.es (J.R. Ramos-Barrado).
0921-5107/$ – see front matter © 2004 Elsevier B.V. All rights reserved.
doi:10.1016/j.mseb.2004.03.010
88
R. Romero et al. / Materials Science and Engineering B 110 (2004) 87–93
substrates. Substrate temperature was kept at 573 K with an
accuracy of
±2
K. The solution flow rate and gas pressure
was kept constant at 50 ml h
−1
and 3 kg cm
−2
, respectively.
The nozzle to substrate distance was 10 cm. Aluminium dop-
ing was achieved by adding aluminium trichloride to the
starting solution. The doping level in the solution, defined by
a 100
×
[Al]/([Al]
+
[Zn]) atomic ratio, was of 1%, and the
deposition time was 15 min. Film thickness was determined
ex situ by means of XRF (Siemens, SRS 3000) and the at-
tenuation of the Si K signal in films deposited on Si, with
an accuracy of
±5
nm. After deposition, the films were al-
lowed to cool down to room temperature and then removed
for further characterization. A more detailed description of
the method to obtain the thin films and the characteristics
of the spray pyrolysis device used were reported in previous
papers
[14,15].
Film structure was characterized by the X-ray diffraction
method using Cu K radiation in a conventional goniome-
ter with a
θ–2θ
scanning mechanism. Surface, depth down
composition, and electronic states of the ions of pure and
doped ZnO films were studied by X-ray photoelectron spec-
troscopy (XPS). XPS spectra were obtained using a Physical
Electronic model PHI 5700 X-ray photoelectron spectrom-
eter with Mg K radiation (1253.6 eV) and Al K radiation
(1486.6 eV) as excitation sources. The energy scale of the
spectrometer was calibrated using Cu 2p
3/2
, Ag 3d
5/2
and
Au 4f
7/2
photoelectron lines at 932.7, 368.3 and 84.0 eV, re-
spectively. A PHI ACCESS ESCA-V6.0 F software package
was used for data acquisition and analysis. Atomic concen-
trations were determined from the photoelectron peak areas
using Shirley background substraction
[16]
and sensitivity
factors provided by the instrument manufacturer. All sample
spectra were referred to the C1s line of the residual carbon
set at 284.8 eV. Depth profiling was carried out using 4 keV
Ar
+
bombardment at a current density of
∼3
A cm
−2
. A
sputter rate of 0.5 nm min
−1
was assumed, as determined by
Ta
2
O
5
under the same sputter conditions.
Electrical properties were determined by admittance spec-
troscopy using a Broadband Dielectric Converter (BDC)
from Novocontrol with a Solartron 1255 Frequency Re-
sponse Analyzer (FRA) for a frequency range between 1 Hz
and 1 MHz. The n-ZnO/p-Si heterojunction was placed in a
Novocontrol sample holder modified in our laboratory; the
ohmic contact with the p-Si substrate was performed with
Al and with the n-Si with In–Ga. The temperature range
was between 223 and 373 K, and was controlled by a Quatro
temperature controller from Novocontrol.
Fig. 1. X-ray diffractogram obtained from a 150 nm thick film of pure
ZnO on p-Si(0 0 1) and ZnO:Al (Al doped 1 at.%).
observed at 2θ
=
34.24 and 36.26
◦
[JCPDS card 05-0664].
The XRD spectrum of pure ZnO shows a powder-like pattern
with no preferred growth orientation; the lattice parameters,
c
and
a,
are estimated to be 5.24 and 3.24 Å, respectively.
Similar values are observed in the ZnO:Al doped film. These
results are in good agreement with those from previously
published papers
[14,15].
However, when the thickness of the films increases, e.g.
to 300 nm, we can observe that the films grow preferentially
along the
c-axis
orientation in a (0 0 2) orientation (Fig.
2),
3. Results and discussion
3.1. Structural properties
Fig. 1
shows a typical X-ray diffractogram obtained from
a 150 nm thick film of pure ZnO on p-Si(0 0 1) and ZnO:Al
(1 at.%). As we can see, the ZnO(0 0 2) and (1 0 1) peaks are
Fig. 2. X-ray diffractogram obtained from a 300 nm thick film of pure
ZnO on p-Si(0 0 1).
R. Romero et al. / Materials Science and Engineering B 110 (2004) 87–93
89
Fig. 3. Wide scan XPS (0–1200 eV) spectra of a ZnO thin film prepared
at 573 K and etched for 30 s with 4 keV Ar
+
.
Fig. 4. Optical transmittance spectra of pure and 1% Al-doped ZnO thin
films as a function of the wavelength in the range 300–900 nm.
and vertically to the substrate; the lattice parameter
c
is
estimated to be 5.24 Å. For the pure ZnO, the peak at 34.2
◦
has more relative intensity than the peak at 36.25
◦
, which
is very small. The mean crystallite size of the sample is
evaluated by means of the Scherrer formula
[17];
the grain
size has been estimated to be
≈255.12
and 429 Å for 150 and
300 nm thicknesses, respectively; no significant difference
can be observed with ZnO:Al doped films.
3.2. Compositional and chemical surface states
Fig. 3
shows the wide scan (0–1200 eV) XPS spectra in
the binding energy range of 0–1200 eV for a ZnO thin film
prepared at 573 K, and sputtered in the spectrometer for 30 s
with 4 keV Ar
+
in order to reduce the amount of adventitious
carbon.
An XPS atomic ratio of Zn/O of 1.02/1.00 (±2%) was
determined using the integrated peak area and sensitivity
factors. For the ZnO:Al (1 at.%) doped films (not shown),
the Al 2p line consists of a highly symmetrical peak lo-
cated at 74.27 eV. This value is close to that reported for
Al
2
O
3
. A more detailed discussion about the XPS results of
the Al doped ZnO thin films will be presented in another
paper.
3.3. Optical properties
Fig. 4
shows the optical transmittance spectra of pure ZnO
and ZnO:Al doped thin films as a function of wavelength
in the range 300–900 nm. The undoped film transmittance
spectra exhibit an average transmittance over 95% in the
visible range of the optical spectrum. Doped films prepared
under the same conditions but with a longer deposition time,
exhibit a slight reduction in their transmittance, to 70%,
because the thickness is higher and the homogeneity is lower
as observed from SEM pictures not shown here. Since the
ZnO is a direct transition semiconductor,
α
is related to the
optical energy band gap (E
g
) by
(h�½α)
2
=
β(h�½
−
E
g
)
(1)
where
α
is the optical absorption coefficient,
h�½
the energy of
the incident photon and
β
is the edge width parameter
[18].
E
g
is determined by extrapolating the straight-line portion
of (1) to
h�½α
=
0. The doped films present a larger band
gap (3.315 eV) than the pure ZnO films (3.307 eV).
3.4. C–V characteristics: barrier height and donor carrier
density
The potential barrier at the junction can be measured by
small-signal capacitance–voltage (C–V)
[19]
characteris-
tics.
Fig. 5
presents the
C–V
characteristics in the reverse
bias region at 300 K for the n-ZnO:Al/p-Si and n-ZnO/p-Si
heterojunctions at 1 MHz. As can be seen, the capaci-
tance of the heterojunction is decreased with an increase
in the reverse bias with an approximately linear
C
−2
–V
bias
Fig. 5.
C–V
characteristics in the reverse bias region at 300 K for the
n-ZnO:Al/p-Si and n-ZnO/p-Si heterojunctions at 1 MHz.
90
R. Romero et al. / Materials Science and Engineering B 110 (2004) 87–93
Fig. 6.
C
−2
–V
bias
relationship for the n-ZnO:Al/p-Si and n-ZnO/p-Si
heterojunctions at 1 MHz.
Table 1
Characteristic parameters of pn junction
n-ZnO/p-Si
N
D
(m
−3
)
V
b
(eV)
W
(nm)
5
×
10
23
0.66
34
n-ZnO:Al/p-Si
9
×
10
23
0.70
26
n-ZnO/n-Si
5
×
10
23
0.50
30
n-ZnO:Al/n-Si
9
×
10
23
0.56
24
relationship (Fig.
6).
This means that the depletion region
in the vicinity of the heterojunction interface is expanded
with an increase in the reverse bias. This
C–V
characteristic
is also described by the conventional heterojunction theory:
qN
D
N
A
ε
1
ε
2
1
C
2
=
(2)
2(N
A
ε
1
+
N
D
ε
2
) (V
D
+
V
b
)
Here,
N
D
is the donor density in n-ZnO,
N
A
the acceptor den-
sity in p-Si,
ε
1
and
ε
2
are the dielectric constants of n-ZnO
and p-Si, respectively, and
V
b
is the applied voltage. Using
Eq. (2),
we can determine the effective space charge density
of the depletion region of both heterojunctions from the slope
of the
C
−2
(V
b
) relationship. The values obtained are pre-
sented in
Table 1
for
ε
r
(ZnO)
=
8 and
ε
r
(Si)
=
12
[19].
The
values obtained for
N
D
in n-ZnO:Al 1 at.% (9
×
10
23
m
−3
)
and n-ZnO (5
×
10
23
m
−3
) are higher than for
N
A
in p-Si,
where
N
A
is estimated to be about 8
×
10
20
m
−3
from the
resistivity of p-Si (9
−1
cm). These results indicate that the
junction is an abrupt p–n
+
type junction. The built-in poten-
tial V
D
, or diffusion potential, is estimated to be 0.66 and
0.7 eV for the ZnO:Al/p-Si and ZnO/p-Si junctions, respec-
tively. This result is consistent with the energy difference
between the work functions of Si and ZnO. The Fermi level
below the vacuum level is 4.97 eV for p-Si, and 4.25 eV for
n-ZnO. The difference between them is 0.72 eV. The results
obtained for n-ZnO/n-Si are very similar (not shown here).
The built-in potential is 0.56 eV for the n-ZnO:Al junc-
tion (1 at.%)/n-Si and 0.50 for the ZnO/n-Si.
Fig. 7
shows
the band diagram for the n-ZnO/p-Si and the n-ZnO/n-Si
junctions.
Table 1
presents the most important values.
The most likely reason for a more complex behavior
(n-ZnO:Al/p-Si and n-ZnO:Al/n-Si), compared to the model
of a simple p–n
+
heterojunction, are the defects at or near the
n-ZnO:Al/c-Si interface, which cause a Fermi energy pin-
ning. The pinning effect makes the height of the energy bar-
rier independent of the ZnO work function. As shown in the
literature
[19],
the Fermi energy at metal/n-semiconductor
interfaces is often pinned at about
E
g
/3. In the case of Si
(E
g
=
1.12 eV), this corresponds to 0.37 eV above the va-
lence band edge. Making this assumption, the energy bar-
rier at the interface seen by the free electrons in 9
−1
cm
p-Si is 0.53 eV, which is quite consistent with our 1/C
2
–V
measurements (0.56 eV).
3.5. Admittance spectroscopy
Thermal admittance spectroscopy is a technique which
allows thermal emission rates of deep levels from the varia-
tion of capacitance and conductance of a junction as a func-
tion of temperature and frequency
[20,21]
to be determined.
These variations are due to the change in frequency of the
measuring signal with respect to the time constant of charge
and discharge processes of the deep level around the point
of the space charge region where both time constants are
Fig. 7. Band diagram for the n-ZnO/p-Si and the n-ZnO/n-Si.
R. Romero et al. / Materials Science and Engineering B 110 (2004) 87–93
91
equal. Under dark conditions, this point coincides with the
crossing point of the Fermi level with the deep level.
We can model the n-ZnO:Al/p-Si as a p–n
+
diode het-
erojunction having a single diode composed of a parallel
combination of a capacitor,
C
D
, and a resistor,
R
D
, in par-
allel with series connected capacitance and resistance ele-
ments,
C
ds
and
R
ds
, due to deep state responses to the in and
out-of-phase applied oscillating signal
[22];
C
D
capacitance
represents the high-frequency capacitance due to the deple-
tion region, and
R
D
describes the leakage path that often ac-
companies heterojunction devices and can physically arise
from generation-recombination current within the depletion
region, local shorting out defects across the thin film, or
leakage due to periphery effects. If
G
D
>
G
ds
(G
D
=
1/R
D
),
then the parallel leakage can dominate the real part of the
complex admittance across the device and render the contri-
bution of the trap difficult to determine. This problem is es-
pecially troublesome if
G
D
changes with temperature, as is
often the case, because even a change in the conductance of
the junction with temperature is difficult to interpret unam-
biguously, and it is necessary to eliminate the contribution
of the parallel conductance to the admittance of the junc-
tion. We can eliminate the
G
D
conductance by determining
the elements of the equivalent circuit from a complex fitting
method (LEVM from Macdonald)
[23]
and then subtracting
the effect of the parallel conductance to the experimental
data, or fitting the experimental capacitance and conduc-
tance to the corresponding values of capacitance and con-
ductance of this model. The capacitance and conductance
for this model are:
C
ds
C
t
=
C
D
+
(3)
1
+
(ωτ)
2
G
ds
(τω)
2
G
t
=
G
D
+
1
+
(τω)
2
(4)
Fig. 8. Characteristic time for the deep states for the n-ZnO:Al/p-Si and
n-ZnO/p-Si junction.
where
τ
ds
is the time characteristic (inverse emission fre-
quency) for the defect associated with the quantities
C
ds
and
G
ds,
and
ω
is the angular frequency of the applied oscillat-
ing signal
[18].
Both methods are in very good agreement.
Interface states can be determined from admittance spec-
troscopy
[18].
Using appropriate modeling, the measured
conductance as a function of frequency can be associated to
the density of the interface states (D
ds
). The density of in-
terface states and the capacitance due to the interface states
are related by the equation
C
ds
=
qD
ds
(5)
where
τ
ds
is the trap time constant.
Fig. 8
presents the
trap time constant for the n-ZnO/p-Si and
Fig. 9
shows the
(G
t
−
G
ds
)/ω data as a function of the logarithm of the
frequency and the fitting for
Eq. (6)
at different tempera-
tures at zero bias voltage. The nature of these peaks sug-
gests that they may be associated with narrow defect energy
levels.
A characteristic frequency exists for each energy level
in the band gap. The inverse characteristic frequency is the
characteristic time associated with that energy position. This
time is, in effect, the response time for that energy level.
Therefore, if an oscillating signal is applied to the sample at
a frequency greater than that of the characteristic frequency
for a given defect level, that defect level will not be able
to respond to the applied signal. This property establishes a
demarcation energy associated with the applied signal such
that defects with energy positions below this level (having
higher response frequencies) will be able to respond to the
signal, but those defects with energy positions above this
where
C
ds
is the capacitance,
D
ds
the density of the interface
states and
q
is the electronic charge. The equation describ-
ing the measured parallel conductance versus the frequency
relationship to the
D
ds
used for this junction was obtained
from
Eq. (4):
G
tot
=
G
ds
+
qD
ds
ωτ
ds
2
1
+
ω
2
τ
ds
(6)
Fig. 9. (G
−
G
D
)/ω data as a function of the logarithm of the frequency
and the fitting for
Eq. (5)
at different temperatures at zero bias voltage
for n-ZnO:Al/p-Si.
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